[EUREKA or EUROSTARS] A Korean company is looking for R&D partners to develop copper sintered material for power semiconductor package bonding

In semiconductor packaging, especially for power semiconductors, the chip bonding materials and processes are very crucial for the reliability and lifespan of modules because they greatly affect their efficient heat emission performance. Recently, high-lead or lead-free soldering is used at high temperatures component assembly for power semiconductor chip modules. However, high-lead material causes environmental problems and lead-free soldering technology has reliability problems due to its low melting point when used for a long time in high-temperature circumstances. Therefore, sinter-bonding technology using silver or copper paste is being researched in order to overcome the above-described limitations of high-lead or lead-free soldering. A Korean SME, who has manufactured epoxy solder paste and in-depth experiences in developing package bonding materials, is looking for a researching partner to develop copper sintered material. Compared to silver sintered materials, copper sintered materials have similar advantages to silver sintered material such as excellent stability, conductivity, and reliability in high temperature circumstances and can be provided at a lost cost. The sought partner preferably has expertise in materials and its roles are to find appropriate chemical elements for reduction of copper oxide film and evaluate of the performance. With the partner, the Korean SME wants to apply for EUREKA or EUROSTARS3 programme in the first half of 2022.